Tantalum is used for a variety of thin film applications: as a diffusion barrier material in logic, and memory devices, as a gate electrode in MOSFET devices and as a protective coating on print head devices.
Tosoh offers a variety of Tantalum targets using OEM and Tosoh-modified designs for all major platforms. Purities ranging from 3N5 to 5N+ are available. Texture and grain size can be tailored for applications ranging from ultra-high performance to minimal-cost needs.
Both solder bonded and Tosoh’s high power Prelude™ diffusion bonded assemblies are made with Tosoh’s well-known Cost of Ownership improvements and technologies. Exclusive DMFM techniques have been applied to design custom right-size and XTREME™ long life designs.