Titanium Target Materials

Tosoh offers Titanium targets for all major OEM PVD systems. Targets for all wafer sizes can be made in purities ranging from 3N to 5N+. Through control of the target metallurgy, oxygen content, surface finish and assembly technology, Tosoh offers titanium targets that light off easily, produce low particulate and provide consistent and repeatable thin films.

Tosoh’s advanced thermo-mechanical processing (ATMP) is used to tailor the target crystallographic texture and grain size for applications ranging from ultra-high performance to minimal-cost needs.

Since leading PVD processes benefit from high power deposition, Tosoh developed and patented its high power PRELUDE™ diffusion bonded target. The unique and robust design ensures that high power deposition results in repeatable thin film performance without the risk of debonding.

The choice of backing plate material is critical for the deposition of advanced titanium thin films. 

Through Tosoh SMD’s leadership in materials technology and FEA modeling, we have developed backing plate materials that reduce target deflection and the associated particle generation. Furthermore, PVD deposition tools that employ high strength magnets for enhanced ionization require Tosoh’s backing plate materials with controlled electrical properties to reduce eddy current losses and eliminate costly motor drag.